Journals

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*undergraduate student, **graduate student, **postdoctoral fellow

  1. G. Diloyan**, M. Sobel, K. Das, P. Hutapea, Effect of Mechanical Vibrations on Platinum Growth in PEM Fuel Cells: Journal of Power Sources, in press (July issue), 2012.
  2. G. Diloyan**, L. Breziner**, P. Hutapea. Development of a PEM Fuel Cell Powered Scooter: ASME Journal of Fuel Cell Science and Technology, 9 (June Issue), 2012.
  3. T. K. Podder, A. P. Dicker, Y. Yu, K. Darvish, P. Hutapea, A Novel Curvilinear Approach for Prostate Seed Implant: Medical Physics, 39(4), pp. 1887-1892, 2012.
  4. M. Sobel, K. Das, G. Diloyan**, P. Hutapea, A Semi-parametric Bayesian Model for Predicting Platinum Particle Growth in Fuel Cells: American Statistician, submitted, 2012.
  5. P. Strahs*, J. Weaver*, L. C. Breziner**, C. Garant*, K. Shaffer*, G. Diloyan**, P. Hutapea. Development of a Hybrid PEM Fuel Cell Vehicle: Journal of Renewable and Sustainable Energy, submitted, 2011.
  6. W. S. Slovinsky**, P. Hutapea. Influence of Bolting Parameters on the Failure Mechanisms of Fiber-reinforced Composite-Metal Joints: Mechanics Based Design of Structures and Machines, 38(2), pp. 261-271, 2010.
  7. K. Jacobs*, M. Harper*, E. Meyer*, B. Roth*, P. Hutapea. Development of a Proof-of-Concept Aircraft Smart Control System: Aeronautical Journal (The Royal Aeronautical Society), 113(1147), pp. 587-590, 2009.
  8. Y. Luo**, P. Hutapea. Design of Bone Transport Devices using Smart Material Actuators: ASME Journal of Mechanical Design, 131(9), September 2009.
  9. L. C. Breziner**, P. Hutapea. Influence of Harsh Environmental Conditions on the Failure Mechanisms of Carbon Fiber-reinforced Composite-Metal Joints: Aircraft Engineering and Aerospace Technology, 80(4), pp. 371 – 377, 2008.
  10. P. Hutapea, J. Kim*, A. Guion*, C. Hanna*, N. Heulitt*. Development of a Smart Wing: Aircraft Engineering and Aerospace Technology, 80(4), pp. 439-444, 2008.
  11. Y. Luo**, P. Hutapea. Stress-Strain Behavior of a Smart Magnetostrictive Actuator for a Bone Transport Device: ASME Journal Medical Devices, 2(4), 2008.
  12. M. Smith**, P. Hutapea. Optimizing Adhesively Bonded Metal-Composite Hybrid Joints: Journal of Ship Production, 23(2), pp. 72-81, 2007.
  13. P. Hutapea, J. L. Grenestedt. Modifying Electric Artworks to Improve Dimensional Stability of Microelectronic Substrates: Microelectronics International, 24(1), pp. 15-22, 2007.
  14. P. Hutapea, J. L. Grenestedt, M. Modi, M. Mello, K. Frutschy. Prediction of Microelectronic Substrate Warpage Using Homogenized Finite Element Models: Intel Technology Journal, 10 (2) (invited), 2006.
  15. P. Hutapea, J. L. Grenestedt, M. Modi, M. Mello, K. Frutschy. Prediction of Microelectronic Substrate Warpage Using Homogenized Finite Element Models: Microelectronic Engineering, 83(3), pp. 557 – 569, 2006.
  16. W. J. Shakespeare, R. A. Pearson, J. L. Grenestedt, P. Hutapea, V. Gupta. MEMS Integrated Submount Alignment for Optoelectronics: Journal of Lightwave Technology, 23(2), pp. 504-509, 2005.
  17. P. Hutapea, J. L. Grenestedt. Reducing Warpage of Printed Circuit Boards using Wavy Traces: Journal of Electronic Packaging, 126(3), pp. 282 – 287, 2004.
  18. P. Hutapea, F. G. Yuan, N. J. Pagano. Microstress Prediction in Composite Laminates with High Stress Gradients: International Journal of Solids and Structures: 40(9), pp. 2215-2248, 2003.
  19. J. L. Grenestedt, P. Hutapea. Influence of Electric Artwork on Thermomechanical Properties and Warpage of Printed Circuit Boards: Journal of Applied Physics: 94(1), pp. 686-696, 2003.
  20. P. Hutapea, J. L. Grenestedt. Effect of Temperature on Elastic Properties of Woven Glass/Epoxy Substrates for Printed Circuit Board Applications: Journal of Electronic Materials, 32(4), pp. 221-227, 2003.
  21. J. L. Grenestedt, P. Hutapea. Using Waviness to Reduce Thermal Warpage in Printed Circuit Boards: Applied Physics Letters, 81(21), pp. 4079-4081, 2002.
  22. P. Hutapea, P. Qiao. Determination of Micropolar In-plane Shear and Rotation Moduli of Unidirectional Fiber Composites with Fiber-Matrix Interfacial Debonding: Journal of Composite Materials, 36(11), pp. 1381-1400, 2002.
  23. P. Hutapea, F. G. Yuan. The Effect of Thermal Aging on the Mode-I Interlaminar Fracture Behavior of High-Temperature IM7/LaRC-RP46 Composites: Composites Science and Technology, 59, pp. 1271-1286, 1999.