Abstracts

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*undergraduate student, **graduate student, ***postdoctoral fellow

  1. B. Dallas**, P. Hutapea. Mechanics of PEM Fuel Cell Stack Compression, ASEE Middle Atlantic Conference, Temple University, Philadelphia, PA, October 28 – 29, 2011.
  2. T. M. Nguyen**, P. Hutapea. Study of Mechanical Behavior of Shape Memory Alloy for Smart Needling System: 4th College of Engineering Research Poster Competition, Temple University, March 2011.
  3. G. Diloyan**, P. Hutapea. Platinum Dissolution in PEM Fuel Cell Under Mechanical Vibrations: 4th College of Engineering Research Poster Competition, Temple University, March 2011.
  4. P. Hutapea. Development of a Hybrid PEM Fuel Cell Vehicle: 2010 World Green Energy Symposium, Philadelphia, PA, October 21 – 23, 2010.
  5. P. Hutapea, PEM Fuel Cell Losses under Vibrations: 2010 Fuel Cells Gordon Research Conference, Bryant University, Smithfield, RI, August 1 – 6, 2010.
  6. L. C. Breziner**, P. Hutapea, Influence of Vibration on Water Transport of PEM Fuel Cells: AIAA/ASME 4th Annual Aerospace/Mechanical Engineering Mini-Symposium, Philadelphia, Pennsylvania, 2008.
  7. K. Davis*, P. Hutapea. Development of an Actuator for a Bone Lengthening Device for Children: Undergraduate Research Presentation at The Capitol, Harrisburg, PA, January 28, 2008.
  8. P. Hutapea, J. Kim*, A. Guion*, C. Hanna*, N. Heulitt*. Development of Smart Wing: AIAA/ASME 3rd Annual Aerospace/Mechanical Engineering Mini-Symposium, Philadelphia, Pennsylvania, 2007.
  9. W. S. Slovinsky**, P. Hutapea. The Influence of Bolting Parameters on the Failure Mechanisms of Fiber-reinforced Composite-Metal Joints: AIAA/ASME 3rd Annual Aerospace/Mechanical Engineering Mini-Symposium, Philadelphia, Pennsylvania, 2007.
  10. L. C. Breziner**, P. Hutapea. The Influence of Harsh Environmental Conditions on the Failure Mechanisms of Carbon Fiber-reinforced Composite-Metal Joints: AIAA/ASME 3rd Annual Aerospace/Mechanical Engineering Mini-Symposium, Philadelphia, Pennsylvania, 2007.
  11. Y. Luo**, P. Hutapea. Development of a Bone Transport Device: AIAA/ASME 3rd Annual Aerospace/Mechanical Engineering Mini-Symposium, 2007.
  12. M. Smith**, P. Hutapea. Optimizing Adhesively Bonded Metal-Composite Hybrid Joints: AIAA/ASME 2nd Annual Aerospace/Mechanical Engineering Mini-Symposium, 2006.
  13. M. El-Mougharbel*, P. Hutapea. Reducing Anisotropy to Improve the Dimensional Stability of Composite Laminates: AIAA/ASME 2nd Annual Aerospace/Mechanical Engineering Mini-Symposium, 2006.
  14. P. Hutapea, B. Bogicevic**. Reliability of Surface Mount Technology Packages: AIAA/ASME 2nd Annual Aerospace/Mechanical Engineering Mini-Symposium, 2006.
  15. W. J. Shakespeare, R. A. Pearson, J. L. Grenestedt, P. Hutapea, V. Gupta. MEMS Integrated Submount Alignment for Optoelectronics: International Microelectronics and Packaging Society (IMAPS) Optoelectronics Device Packaging Topical Workshop and Exhibition, Bethlehem, Pennsylvania, October 11-14, 2004.
  16. J. L. Grenestedt, P. Hutapea. Optimization Techniques for Reducing Warpage of Unpopulated Organic Substrates: International Microelectronics and Packaging Society (IMAPS) Optoelectronics Device Packaging Topical Workshop and Exhibition, Bethlehem, Pennsylvania, October 11-14, 2004.
  17. W. J. Shakespeare, R. A. Pearson, J. L. Grenestedt, P. Hutapea, V. Gupta. MEMS Integrated Submount Alignment for Optoelectronics: Lehigh University Center for Optical Technologies Spring Symposium: Bethlehem, Pennsylvania, November 10, 2003.
  18. J. L. Grenestedt, P. Hutapea. Dimensional Stability of Optoelectronic Packages: Lehigh University Center for Optical Technologies Fall Symposium: Bethlehem, Pennsylvania, November 10, 2003.
  19. J. L. Grenestedt, P. Hutapea. Tuning Organic Substrates for Improving Reliability: International Microelectronics and Packaging Society (IMAPS) Conference on Optoelectronics Packaging and Micro-Optoelectromechanical Systems (MOEMS), Northampton County Community College, Allentown, Pennsylvania, June 5, 2003. Best Presentation Award
  20. P. Hutapea, J. L. Grenestedt. Warpage of Printed Circuit Boards: International Microelectronics and Packaging Society (IMAPS) Conference on Optoelectronics Packaging and Micro-Optoelectromechanical Systems (MOEMS), Bethlehem, Pennsylvania, October 21-23, 2002.
  21. P. Hutapea, J. Wang, P. Graham, E. Setiawan. A Teleoperated Mobile Robocrane: Testbed For Control Algorithm Verification: International Society for Computers and Applications (ISCA) 11th International Conference, pp. 7-10, San Francisco, California, 1996.
  22. J. Wang, P. Graham, P. Hutapea, E. Setiawan, G. K. Lee. A Mobile Manipulator System Using the Robocrane: International Society for Computers and Applications (ISCA) 10th International Conference, pp. 298-302, Indianapolis, Indiana, 1995.
  23. P. Hutapea, P. Graham, E. Setiawan, J. Wang. A Mobile Manipulator System using the Robocrane: A Testbed for Control Algorithm and System Integration Studies: AIAA Southeastern Regional Student Conference, Atlanta, Georgia, 1995.